http://www.luguang.cn email: lge@luguang.cn shenzhen luguang electronic technology co.,l td . 1 1 scope this specification shall cover the characteristics of the ceramic reson- ator with the type zttcs40.0mx 2 part no. part number customer part no. specification no. zttcs40.0mx 3 outline drawing and structure 3.1 appearance no visible damage and dirt. 3.2 dimensions drawing 1 unit:mm 40.0m
k w w s z z z o x j x d q j f q ( p d l o o j h # o x j x d q j f q 6 + ( 1 = + ( 1 / 8 * 8 $ 1 * ( / ( & 7 5 2 1 , & 7 ( & + 1 2 / 2 * < & 2 / 7 ' . 2 4 electrical specifications table 1 items content remark oscillation frequency fosc ? mhz ? 40.0 frequency accuracy ? % ? f 0.5 resonant impedance ro ? ? max. 40 insulation resistance ri, ? m ?? min. 500 ? 100v 1min ? temperature coefficient of oscillation frequency ? % ? max. f 0.3 ? oscillation frequency drift -25 +85 ? rating voltage u r ? v ? max. 6v dc 15v p-p withstanding voltage (v) 50 (dc 1min) operating temperature ( ) -20 +80 storage temperature ( ) -55 +85 aging rate ? % ? max. f 0.3 ? for ten years ? 5 test 5.1 test conditions parts shall be tested under a condition (temperature:+20 15 humidity:65%20%r.h.)unless the standard condition(temperature:+25 3 ,humidity:65%5% r.h.) is regulated to test. 5.2 test circuit: drawing 2 , & 1/6tc74hcu042 x: ceramic resonator 7 , 1 3 8 7 8 * 5 2 8 1 ' 9 2 8 7 3 8 7
k w w s z z z o x j x d q j f q ( p d l o o j h # o x j x d q j f q 6 + ( 1 = + ( 1 / 8 * 8 $ 1 * ( / ( & 7 5 2 1 , & 7 ( & + 1 2 / 2 * < & 2 / 7 ' . 3 6 physical and environmental characteristics table 2 no item condition of test performance requirements 2.1 humidity keep the resonator at 40 2 and 90%~95% rh for 96h 4h. then release the resonator into the room condition for 1h prior to the measurement. it shall fulfill the specifications in table 3. 2.2 high temperature exposure subject the resonator to 85 5 for 96h, then release the resonator into the room conditions for 1h prior to the measurement. it shall fulfill the specifications in table 3. 2.3 low temperature exposure subject the resonator to -25 5 for 96h, then release the resonator into the room conditions for 1h prior to the measurement. it shall fulfill the specifications in table 3. 2.4 temperature cycling subject the resonator to -40 for 30 min. followed by a high temperature of 85 for 30 min.cycling shall be re peated 5 times with a transfer time of 15s. at the room temperature for 1h prior to the measurement. it shall fulfill the specifications in table 3. 2.5 vibration subject the resonator to vibration for 2h each in x ? y and z axis with the amplitude of 1.5mm, the frequency shall be varied uniformly between the limits of 10 hz~55hz. it shall fulfill the specifications in table 3. 2.6 mechanical shock drop the resonator randomly onto a wooden floor from the height of 100cm 3 times. no visible damage and it shall fulfill the specifications in table 3. 2.7 resistance to soldering heat passed through the re-flow oven under the following condition and left at room temperature for 1 hour before measurement. it shall fulfill the specifications in table 3. temperature at the surface of the substrate time preheat 150 5 60s10s peak 240 5 10s3s 2.8 solderability dipped in 230 5 solder bath for 3s0.5s with rosin flux (25wt% ethanol solution.) the terminals shall be at least 95% covered by solder.
k w w s z z z o x j x d q j f q ( p d l o o j h # o x j x d q j f q 6 + ( 1 = + ( 1 / 8 * 8 $ 1 * ( / ( & 7 5 2 1 , & 7 ( & + 1 2 / 2 * < & 2 / 7 ' . 4 table 2 continued 2.9 board bending mount a glass-epoxy board (width=40mm, thickness=1.6mm),then bend it to 1mm displacement and keep it for 5s. (see the following figure) 6 8 3 3 2 5 7 % $ 5 press head 3 5 ( 6 6 mechanical damage such as breaks shall not occur. table 3 specification after test about characteristics no. item specification after test 3.1 oscillation frequency change ? fosc/fosc (%) max 0.3 3.2 resonant impedance change ? ro( ? )max 30 note ? the limits in the above table are refe renced to the initi al measurements. 7 recommended land patter n and reflow soldering standard conditions 7.1 recommended land pattern
k w w s z z z o x j x d q j f q ( p d l o o j h # o x j x d q j f q 6 + ( 1 = + ( 1 / 8 * 8 $ 1 * ( / ( & 7 5 2 1 , & 7 ( & + 1 2 / 2 * < & 2 / 7 ' . 5 drawing 4 7.2 recommended reflow sold ering standard conditions drawing 5 8 package to protect the products in storage and transportation it is necessary to pack them ? outer and inner package ? .on paper pack, the following requirements are requested. 8.1 dimensions and mark at the end of package, the warning (moisture proof, upward put) should be stick to it. dimensions and mark (see below) drawing 6 within 20s-40s within 80s-120s. within 10s pre-heating 3 d f n d j h & h u w l i l f d w h r i d s s u r y d o / d e h o 7 \ l q j $ g k h v l y h w d s h % h o w % r [ , q q h u unit:mm
k w w s z z z o x j x d q j f q ( p d l o o j h # o x j x d q j f q 6 + ( 1 = + ( 1 / 8 * 8 $ 1 * ( / ( & 7 5 2 1 , & 7 ( & + 1 2 / 2 * < & 2 / 7 ' . 6 8.2 section of package package is made of corrugate d paper with thickness of 0.8cm.package has 12 inner boxes, ea ch box has 5 reels (each reel for plastic bag). 8.3 quantity of package per plastic reel 1000 pi eces of piezoelectric ceramic part per inner box 5 reels per package 12 inner boxes ? 60000 pieces of piezoelectric ceramic part ? 8.4 reel max
k w w s z z z o x j x d q j f q ( p d l o o j h # o x j x d q j f q 6 + ( 1 = + ( 1 / 8 * 8 $ 1 * ( / ( & 7 5 2 1 , & 7 ( & + 1 2 / 2 * < & 2 / 7 ' . 7 8.5 packing method sketch map loaded pocket blank pocket 10 pitches leader 200mm max blank pocket 10 pitches 8.6 test condition of peeling strength 10 max top tape p e e l i n g s t r e n g t h 2 0 - 7 0 g carrier tape 9 others 9.1 caution of use 9.1.1 do not use this product w ith bend. please don?t apply axcess mechanical stress to the compone nt and terminals at soldering. 9.1.2 the component may be damage d when an excess stress will be applied. 9.1.3 comformal coating of the co mponent is acceptable,however the resin materials ,curing temperature a nd other process conditions should be evaluated to conform stable electr ical characteristics are maintained. 9.2 notice 9.2.1 this specification mentions the quality of the component as a single unit. please insure the compone nt is thoroughly evaluated in your application circuit. 9.2.2 please return one of this specification after your signature of acceptance. 9.2.3 when something gets doubtful w ith this specifications, we shall jointly work to get an agreement.
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